收藏本站
...the world's most energy friendly microcontrollers
Figure 25.2. ADC Conversion Timing
HFPERCLK ADCn
Prescaled clock (4x)
ADC action
SINGLEAT/
SCANAT
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
6-bit value ready 8-bit value ready
12-bit value ready
25.3.3 Warm-up Time
The ADC needs to be warmed up some time before a conversion can take place. This time period is
called the warm-up time. When enabling the ADC or changing references between samples, the ADC
is automatically warmed up for 1μs and an additional 5 μs if the bandgap is selected as reference.
Normally, the ADC will be warmed up only when samples are requested and is shut off when there are
no more samples waiting. However, if lower latency is needed, configuring the WARMUPMODE field in
ADCn_CTRL allows the ADC and/or reference to stay warm between samples, eliminating the need for
warm-up. Figure 25.3 (p. 345) shows the analog power consumption in scenarios using the different
WARMUPMODE settings.
Only the bandgap reference selected for scan mode can be kept warm. If a different bandgap reference
is selected for single mode, the warm-up time still applies.
? NORMAL: ADC and references are shut off when there are no samples waiting. a) in Figure 25.3 (p.
345) shows this mode used with an internal bandgap reference. Figure d) shows this mode when
using VDD or an external reference.
? FASTBG: Bandgap warm-up is eliminated, but with reduced reference accuracy. d) in Figure 25.3 (p.
345) shows this mode used with an internal bandgap reference.
? KEEPSCANREFWARM: The reference selected for scan mode is kept warm. The ADC will still need
to be warmed up before conversion. b) in Figure 25.3 (p. 345) shows this mode used with an internal
bandgap reference.
? KEEPADCWARM: The ADC and the reference selected for scan mode is kept warm. c) in
Figure 25.3 (p. 345) shows this mode used with an internal bandgap reference.
The minimum warm-up times are given in μs. The timing is done automatically by the ADC, given that
a proper time base is given in the TIMEBASE bits in ADCn_CTRL. The TIMEBASE must be set to the
number of HFPERCLK which corresponds to at least 1 μs. The TIMEBASE only affects the timing of the
warm-up sequence and not the ADC_CLK.
When entering Energy Modes 2 or 3, the ADC must be stopped and WARMUPMODE in ADCn_CTRL
written to 0.
2011-04-12 - d0001_Rev1.10
344
www.energymicro.com
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
EFM32GG-STK3700 KIT STARTER GIANT GECKO
EFM32LG-DK3650 KIT DEV EFM32 LEOPARD GECKO
EK-K7-KC705-CES-G-J KINTEX-7 FPGA KC705 EVAL KIT
EK-S6-SP601-G KIT EVAL SPARTAN 6 SP601
EK-S6-SP605-G KIT EVAL SPARTAN 6 SP605
EK-V6-ML631-G-J VIRTEX-6 HXT FPGA ML631 EVAL KIT
EK-V7-VC707-CES-G VIRTEX-7 VC707 EVAL KIT
EK-Z7-ZC702-CES-G ZYNQ-7000 EPP ZC702 EVAL KIT
相关代理商/技术参数
EFM32GG230F1024 功能描述:ARM微控制器 - MCU 1024KB FL 128KB RAM RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT
EFM32GG230F1024G-E-QFN64R 功能描述:IC MCU 32BIT 1MB FLASH 64QFN 制造商:silicon labs 系列:Giant Gecko 包装:剪切带（CT） 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:48MHz 连接性:I2C，IrDA，智能卡，SPI，UART/USART 外设:欠压检测/复位，DMA，POR，PWM，WDT I/O 数:56 程序存储容量:1MB（1M x 8） 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:128K x 8 电压 - 电源（Vcc/Vdd）:1.98 V ~ 3.8 V 数据转换器:A/D 8x12b，D/A 2x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C（TA） 封装/外壳:64-VFQFN 裸露焊盘 供应商器件封装:64-QFN（9x9） 标准包装:1
EFM32GG230F1024-QFN64 制造商:Energy Micro AS 功能描述:GIANT GECKO MCU - Cut TR (SOS) 制造商:Energy Micro 功能描述:GIANT GECKO MCU 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 1MB FLASH 64QFN
EFM32GG230F1024-QFN64T 制造商:Energy Micro AS 功能描述:GIANT GECKO MCU - Trays
EFM32GG230F1024-QFN64-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 1MB FLASH 64QFN
EFM32-GG230F1024-SK 制造商:Energy Micro AS 功能描述:GIANT GECKO SAMPLE KIT - Bulk
EFM32GG230F1024-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 1MB FLASH 64QFN
EFM32GG230F512 功能描述:ARM微控制器 - MCU 512KB FL 128KB RAM RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT